Contact Edge Roughness: Characterization and modeling

Murugesan-Kuppuswamy, V-K; Constantoudis, V; Gogolides, E

dc.contributor.author	Murugesan-Kuppuswamy, V-K	en
dc.contributor.author	Constantoudis, V	en
dc.contributor.author	Gogolides, E	en
dc.date.accessioned	2014-03-01T02:52:57Z
dc.date.available	2014-03-01T02:52:57Z
dc.date.issued	2011	en
dc.identifier.issn	01679317	en
dc.identifier.uri	https://dspace.lib.ntua.gr/xmlui/handle/123456789/36166
dc.subject	CD uniformity	en
dc.subject	Contact Edge Roughness	en
dc.subject	Contact Hole Roughness	en
dc.subject	Modeling	en
dc.subject	SEM images	en
dc.subject.other	CD Uniformity	en
dc.subject.other	Circular contacts	en
dc.subject.other	Contact Edge Roughness	en
dc.subject.other	Contact edges	en
dc.subject.other	Contact Hole Roughness	en
dc.subject.other	Contact holes	en
dc.subject.other	Critical dimension variations	en
dc.subject.other	Height-height correlation functions	en
dc.subject.other	Line Edge Roughness	en
dc.subject.other	Low-frequency deformation	en
dc.subject.other	SEM images	en
dc.subject.other	Deformation	en
dc.subject.other	Measurement theory	en
dc.subject.other	Roughness measurement	en
dc.title	Contact Edge Roughness: Characterization and modeling	en
heal.type	conferenceItem	en
heal.identifier.primary	10.1016/j.mee.2011.02.003	en
heal.identifier.secondary	http://dx.doi.org/10.1016/j.mee.2011.02.003	en
heal.publicationDate	2011	en
heal.abstract	In this paper, first we clarify the differences between Contact Edge Roughness (CER) and Line Edge Roughness (LER) emanating from the circular form of the contact edge. Then, we investigate the effects of these differences on the characterization of the spatial and frequency aspects of CER: We define the height-height correlation function for a circular contact hole, use its shape to understand low-frequency deformations of contact holes from the ideal circle, generate model contact holes with predetermined CER and deformations, and finally study the relation between CER and Critical Dimension (CD) variation of the contact holes on a wafer. © 2011 Elsevier B.V. All rights reserved.	en
heal.journalName	Microelectronic Engineering	en
dc.identifier.doi	10.1016/j.mee.2011.02.003	en
dc.identifier.volume	88	en
dc.identifier.issue	8	en
dc.identifier.spage	2492	en
dc.identifier.epage	2495	en