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Modeling of charge-trapping non-volatile-memories based on HfO2

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dc.contributor.author Verrelli, E en
dc.contributor.author Tsoukalas, D en
dc.date.accessioned 2014-03-01T02:53:55Z
dc.date.available 2014-03-01T02:53:55Z
dc.date.issued 2012 en
dc.identifier.issn 01679317 en
dc.identifier.uri https://dspace.lib.ntua.gr/xmlui/handle/123456789/36486
dc.subject Charge trap memory en
dc.subject High-k en
dc.subject Modeling en
dc.subject Oxide charge en
dc.subject Simulation en
dc.subject Trap distribution en
dc.subject Trap layer en
dc.subject Tunneling en
dc.subject.other Charge trap en
dc.subject.other High-k en
dc.subject.other Oxide charge en
dc.subject.other Simulation en
dc.subject.other Trap distributions en
dc.subject.other Trap layers en
dc.subject.other Electron tunneling en
dc.subject.other Hafnium en
dc.subject.other Models en
dc.subject.other Silica en
dc.subject.other Hafnium oxides en
dc.title Modeling of charge-trapping non-volatile-memories based on HfO2 en
heal.type conferenceItem en
heal.identifier.primary 10.1016/j.mee.2011.04.020 en
heal.identifier.secondary http://dx.doi.org/10.1016/j.mee.2011.04.020 en
heal.publicationDate 2012 en
heal.abstract In the present work we present experimental results and the first simulation results concerning the charge-trapping properties of devices based on HfO2, MNOS-like, for non-volatile-memory applications. Hafnium oxide sputtered on top of a silicon dioxide tunneling layer represents the storage layer for the charges injected/extracted from the p-type silicon substrate. Although no blocking oxide on top of the structure has been considered in this study, electrical characterization shows large hysteresis at voltages lower than 12 V. Insight to the physics underlying the behavior of such a device is given using a simulator presented in this work. The simulation of the programming characteristics will be presented and compared with those obtained from the fabricated devices giving insight to the properties of the traps involved. Good agreement is found between measured and simulated data. © 2011 Elsevier B.V. All rights reserved. en
heal.journalName Microelectronic Engineering en
dc.identifier.doi 10.1016/j.mee.2011.04.020 en
dc.identifier.volume 90 en
dc.identifier.spage 23 en
dc.identifier.epage 25 en


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