Slow-crack propagations through bimaterial interfaces studied by scanning electron microscopy

Stassinakis, CA; Theocaris, PS; Kytopoulos, V

dc.contributor.author	Stassinakis, CA	en
dc.contributor.author	Theocaris, PS	en
dc.contributor.author	Kytopoulos, V	en
dc.date.accessioned	2014-03-01T01:06:39Z
dc.date.available	2014-03-01T01:06:39Z
dc.date.issued	1986	en
dc.identifier.issn	0022-2461	en
dc.identifier.uri	https://dspace.lib.ntua.gr/xmlui/handle/123456789/9549
dc.subject	Crack Propagation	en
dc.subject	Mechanical Property	en
dc.subject	Scanning Electron Microscope	en
dc.subject	Scanning Electron Microscopy	en
dc.subject	Stress Intensity Factor	en
dc.subject	Crack Tip Opening Angle	en
dc.subject.classification	Materials Science, Multidisciplinary	en
dc.subject.other	FRACTURE MECHANICS	en
dc.subject.other	MICROSCOPES, ELECTRON - Applications	en
dc.subject.other	BIMATERIAL INTERFACES	en
dc.subject.other	SCANNING ELECTRON MICROSCOPE	en
dc.subject.other	SLOW-CRACK PROPAGATIONS	en
dc.subject.other	EPOXY RESINS	en
dc.title	Slow-crack propagations through bimaterial interfaces studied by scanning electron microscopy	en
heal.type	journalArticle	en
heal.identifier.primary	10.1007/BF00553246	en
heal.identifier.secondary	http://dx.doi.org/10.1007/BF00553246	en
heal.language	English	en
heal.publicationDate	1986	en
heal.abstract	The scanning electron microscope (SEM) is used for the study of slow crack propagation through a bimaterial interface. This work is concerned with the variation of crack velocity, the variation of crack tip opening angle (CTOA) and the stress intensity factor (K) at the crack tip, and the investigation of crack arrest phenomena at the bimaterial interface. It was observed that the crack accelerates to a maximum velocity as the crack tip approaches the interface and then decreases rapidly to a minimum value at the interface. The interface acts as a ""decelerator"" to crack propagation. The position and the value of the maximum velocity depends on the mechanical properties of two phases and specimen configuration. The crack propagates at a constant CTOA until it arrests at the interface. During the crack-arrest time the CTOA increases rapidly to a limiting value. Then the crack passes across the interface and propagates in the next phase with almost the same CTOA as the initial crack in phase I. The stress intensity factor, K, increases to a maximum value near the bimaterial interface. © 1986 Chapman and Hall Ltd.	en
heal.publisher	Kluwer Academic Publishers	en
heal.journalName	Journal of Materials Science	en
dc.identifier.doi	10.1007/BF00553246	en
dc.identifier.isi	ISI:A1986A518800009	en
dc.identifier.volume	21	en
dc.identifier.issue	4	en
dc.identifier.spage	1155	en
dc.identifier.epage	1160	en