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Pattern matching, simulation, and metrology of complex layouts fabricated by electron beam lithography

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dc.contributor.author Tsikrikas, N en
dc.contributor.author Drygiannakis, D en
dc.contributor.author Patsis, GP en
dc.contributor.author Raptis, I en
dc.contributor.author Gerardino, A en
dc.contributor.author Stavroulakis, S en
dc.contributor.author Voyiatzis, E en
dc.date.accessioned 2014-03-01T01:26:54Z
dc.date.available 2014-03-01T01:26:54Z
dc.date.issued 2007 en
dc.identifier.issn 1071-1023 en
dc.identifier.uri https://dspace.lib.ntua.gr/xmlui/handle/123456789/18269
dc.subject Electron Beam Lithography en
dc.subject Pattern Matching en
dc.subject.classification Engineering, Electrical & Electronic en
dc.subject.classification Nanoscience & Nanotechnology en
dc.subject.classification Physics, Applied en
dc.subject.other Computer simulation en
dc.subject.other Computer software en
dc.subject.other Electron beam lithography en
dc.subject.other Microprocessor chips en
dc.subject.other Random processes en
dc.subject.other Chip layouts en
dc.subject.other Complex layouts en
dc.subject.other Stochastic simulations en
dc.subject.other Pattern matching en
dc.title Pattern matching, simulation, and metrology of complex layouts fabricated by electron beam lithography en
heal.type journalArticle en
heal.identifier.primary 10.1116/1.2798714 en
heal.identifier.secondary http://dx.doi.org/10.1116/1.2798714 en
heal.language English en
heal.publicationDate 2007 en
heal.abstract Validation of design rules taking into account fine details such as line-edge roughness, and full chip layout simulation for design inconsistencies, before actual fabrication, are among the main objectives of current software assisted metrology tools. Line-edge roughness quantification should accompany critical dimension (CD) measurements since it could be a large fraction of the total CD budget. A detailed simulation and metrology approach of line-edge roughness quantification versus the length scales in a layout are presented in this work using a combination of electron beam simulation for the exposure part, and stochastic simulations for the modeling of resist film, postexposure bake, and resist dissolution. The method is applied also on a test layout with critical dimension of 200 nm and the resulted simulation and scanning electron microscopy images are compared with the aid of a pattern matching algorithm which enables the identification of the desired layout for metrology on a complex layout containing many printed features. (c) 2007 American Vacuum Society. en
heal.publisher A V S AMER INST PHYSICS en
heal.journalName Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures en
dc.identifier.doi 10.1116/1.2798714 en
dc.identifier.isi ISI:000251611900107 en
dc.identifier.volume 25 en
dc.identifier.issue 6 en
dc.identifier.spage 2307 en
dc.identifier.epage 2311 en


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