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Evaluation of dielectric behaviour of particulate composites consisting of polymeric matrix and conductive filler

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dc.contributor.author Tsangaris, GM en
dc.contributor.author Psarras, GC en
dc.contributor.author Kouloumbi, N en
dc.date.accessioned 2014-03-01T11:44:25Z
dc.date.available 2014-03-01T11:44:25Z
dc.date.issued 1996 en
dc.identifier.issn 0267-0836 en
dc.identifier.uri https://dspace.lib.ntua.gr/xmlui/handle/123456789/36936
dc.relation.uri http://www.scopus.com/inward/record.url?eid=2-s2.0-0001339118&partnerID=40&md5=1d2d06bb59cd570b1e958d6991ab81f7 en
dc.subject.classification Materials Science, Multidisciplinary en
dc.subject.classification Metallurgy & Metallurgical Engineering en
dc.subject.other EPOXY-RESIN en
dc.subject.other PERMITTIVITY en
dc.title Evaluation of dielectric behaviour of particulate composites consisting of polymeric matrix and conductive filler en
heal.type other en
heal.language English en
heal.publicationDate 1996 en
heal.abstract Extension of the logarithmic law of mixtures enables equations to be formulated which describe the dielectric behaviour of particulate polymeric composites containing conductive particles. These equations give the permittivity and dielectric loss of the composite as a function of the permittivity of the polymeric matrix, the volume fraction and aspect ratio of the inclusions, and the frequency of the applied field. The proposed equations were tested with experimental data obtained over a wide range of frequencies and temperatures from composites consisting of epoxy resin and aluminium powder. Satisfactory agreement was observed when the volume fraction of the inclusions was small, but at higher values discrepancies appealed which are attributed to the intrinsic weakness of the logarithmic law of mixtures, on which the proposed equations are based. (C) 1996 The Institute of Materials. en
heal.publisher INST MATERIALS en
heal.journalName Materials Science and Technology en
dc.identifier.isi ISI:A1996VU15300001 en
dc.identifier.volume 12 en
dc.identifier.issue 7 en
dc.identifier.spage 533 en
dc.identifier.epage 538 en


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