Reliability issues in deep deep sub-micron technologies: time-dependent variability and its impact on embedded system design

Papanikolaou, A; Miranda, M; Wang, H; Catthoor, F; Satyakiran, M; Marchal, P; Kaczer, B; Bruynseraede, C; Tokei, Z

dc.contributor.author	Papanikolaou, A	en
dc.contributor.author	Miranda, M	en
dc.contributor.author	Wang, H	en
dc.contributor.author	Catthoor, F	en
dc.contributor.author	Satyakiran, M	en
dc.contributor.author	Marchal, P	en
dc.contributor.author	Kaczer, B	en
dc.contributor.author	Bruynseraede, C	en
dc.contributor.author	Tokei, Z	en
dc.date.accessioned	2014-03-01T02:50:16Z
dc.date.available	2014-03-01T02:50:16Z
dc.date.issued	2006	en
dc.identifier.uri	https://dspace.lib.ntua.gr/xmlui/handle/123456789/35014
dc.subject	Embedded System Design	en
dc.subject	Energy Consumption	en
dc.subject	Paradigm Shift	en
dc.subject	Quality Metric	en
dc.subject	System Level Design	en
dc.subject	Technology Scaling	en
dc.subject	Deep Sub Micron	en
dc.subject	Time Dependent	en
dc.title	Reliability issues in deep deep sub-micron technologies: time-dependent variability and its impact on embedded system design	en
heal.type	conferenceItem	en
heal.identifier.primary	10.1109/VLSISOC.2006.313258	en
heal.identifier.secondary	http://dx.doi.org/10.1109/VLSISOC.2006.313258	en
heal.publicationDate	2006	en
heal.abstract	Technology scaling has traditionally offered advantages to embedded system design in terms of reduced energy consumption and cost and increased performance. Scaling past the 45 nm tech- nology node, however, brings a host of problems, whose impact on system-level design has not been evaluated. Random intra- die process variability, reliability and their combined impact on the system level parametric quality	en
heal.journalName	Very Large Scale Integration	en
dc.identifier.doi	10.1109/VLSISOC.2006.313258	en