HEAL DSpace

THE APPLICABILITY OF LOGARITHMIC EXTREME-VALUE DISTRIBUTIONS IN ELECTOMIGRATION INDUCED FAILURES OF AL/CU THIN-FILM INTERCONNECTS

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dc.contributor.author LOUPIS, MI en
dc.contributor.author AVARITSIOTIS, JN en
dc.date.accessioned 2014-03-01T11:44:24Z
dc.date.available 2014-03-01T11:44:24Z
dc.date.issued 1995 en
dc.identifier.issn 0026-2714 en
dc.identifier.uri https://dspace.lib.ntua.gr/xmlui/handle/123456789/36932
dc.subject Electromigration en
dc.subject Extreme Value Distribution en
dc.subject Failure Rate en
dc.subject Grain Size en
dc.subject Log-normal Distribution en
dc.subject Statistical Model en
dc.subject Thin Film en
dc.subject.classification Engineering, Electrical & Electronic en
dc.subject.classification Nanoscience & Nanotechnology en
dc.subject.classification Physics, Applied en
dc.subject.other ELECTROMIGRATION FAILURE en
dc.subject.other MODEL en
dc.title THE APPLICABILITY OF LOGARITHMIC EXTREME-VALUE DISTRIBUTIONS IN ELECTOMIGRATION INDUCED FAILURES OF AL/CU THIN-FILM INTERCONNECTS en
heal.type other en
heal.identifier.primary 10.1016/0026-2714(95)93079-P en
heal.identifier.secondary http://dx.doi.org/10.1016/0026-2714(95)93079-P en
heal.language English en
heal.publicationDate 1995 en
heal.abstract In electromigration failure studies it is in general assumed that electromigration induced failures may be adequately modelled by a log normal distribution. Further to this it has been argued that a log normal distribution of failure times is indicative of electromigration mechanisms. We have combined post processing of existing life-data from Al/Cu+TiW bilayer interconnects with our own results from Al/Cu interconnects to show that the Log Extreme Value distribution is an equally good statistical model for electromigration failures, even in cases where grain size exceeds the line width. The significance of such a modelling is particularly apparent in electromigration failure rate prediction. en
heal.publisher PERGAMON-ELSEVIER SCIENCE LTD en
heal.journalName MICROELECTRONICS AND RELIABILITY en
dc.identifier.doi 10.1016/0026-2714(95)93079-P en
dc.identifier.isi ISI:A1995QJ90500016 en
dc.identifier.volume 35 en
dc.identifier.issue 3 en
dc.identifier.spage 611 en
dc.identifier.epage 617 en


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